LiquidCool Solutions for Every Computing Environment
Our patented Total Liquid Immersion with Directed Flow technology helps organisations manage rising compute density while reducing cooling complexity, energy use and water dependency.
High-Density Cooling
with LCS ZPServer™
As data centre compute density increases, conventional air cooling can become increasingly difficult to scale. LCS ZPServer™ uses patented Total Liquid Immersion with Directed Flow™ (TIDF™) technology to efficiently remove heat from high-performance server components.
Designed for modern data centres and AI infrastructure, ZPServer™ supports up to 70 kW per standard rack unit, with cooling PUE <1.03, no water and no air conditioning.
Up to 70 kW
per rack unit
PUE as low
as 1.03
No water
Fits in standard
19” racks
High-Density Cooling
for AI & HPC
AI and HPC workloads are increasingly moving closer to where data is generated. LCS SSS™ brings high-performance liquid-cooled computing to the edge in a compact, scalable 24U rack.
Configured with 4–6 ZPServers, SSS™ provides a self-contained platform for environments where conventional server-room infrastructure may be difficult or impractical.
24U rack
Self-contained
Scalable to 42U
Industrial Computing with Sealed Protection
Deploy reliable computing where conventional systems struggle. LCS MiniNODE™ combines total liquid immersion cooling with a rugged IP67-sealed enclosure, protecting electronics from dust, humidity, salt, oxidation and corrosive environments.
Designed for industrial and remote applications, MiniNODE™ delivers fanless, water-free cooling, low maintenance and reliable operation from 0°C to 45°C.
Can be deployed
anywhere
PUE <1.03
No water
No A/C
Ready for a Smarter Cooling Strategy?
Whether you are building an AI data centre, upgrading high-density infrastructure or deploying computing at the edge, LiquidCool Solutions can help you rethink how heat is managed.
