When Compute Gets
Hotter,
Air Has Its Limits.
Higher compute density needs a better way to manage heat.
Engineering Around the Real Constraints
Same Rack. More Compute.
More compute in the same rack.
Engineering Advantages
Designed around high-density heat.
Measured Performance
Tested performance. Measurable results.
Deployment & Serviceability
Rack-ready. Contained. Serviceable.
Built for Real Workloads
AI. HPC. Data centre. Edge.
Resource Efficiency
Less air. Less water dependency.
More Thermal Capacity. Less Cooling Overhead.
Built for Real Workloads
AI. HPC. Data centre. Edge.
Reduced Acoustic Impact
Quiet, fan-free operation.
Heat Recovery
Recover usable heat.
More Compute in Less Space
More compute. Less space.
Higher Thermal Capacity
Move heat efficiently.
Lower Cooling Overhead
Reduce cooling overhead.
Immersion Meets Directed Flow for Smarter Heat Removal
Total immersion. Directed flow.
Rack-ready architecture.
Rethinking How Heat Is Managed
Compare The Architectures.
| Characteristic | Air Cooling | Direct-To-Chip | Tank Immersion | TIDF® |
|---|
| Thermal Medium | Air | Liquid + Air | Liquid | Liquid |
| Board Coverage | Limited By Airflow | Targeted Components | Full Immersion | Full Component Immersion |
| Directed Coolant Flow | No | Targeted | Typically Passive | Yes |
| Server Fans | Required | Often Retained | Eliminated | Eliminated |
| Architecture | Air-Cooled Rack | Hybrid Cooling | Open Immersion Tank | Sealed Chassis |
| Rack Integration | Standard | Standard | Tank Infrastructure | Standard 19" Rack |
| Service Model | Familiar | Familiar But Hybrid | Tank-Based | Contained, Serviceable Chassis |
| Cooling Approach | Air Movement | Processor-Focused | Immersion | Immersion + Directed Flow |
Where Cooling Efficiency
Meets Resource Responsibility.
Sustainability is not just about how efficiently you cool. It is also about what you avoid replacing.
LiquidCool is designed to work with standard 19" racks, helping operators adopt immersion cooling without unnecessary rip-and-replace upgrades. By preserving existing infrastructure and extending the lifecycle of proven assets, the transition to more efficient cooling can mean less waste, lower embodied carbon and less disruption.
And as computing demands continue to grow, LiquidCool helps make better use of critical resources.
Preserve Existing Infrastructure
Integrate with standard 19" racks to help reduce unnecessary equipment replacement and infrastructure waste.
Reduce Cooling Overhead
Engineered for direct heat transfer, dielectric fluid cooling reduces the energy demand of conventional cooling.
Reduce Water Dependency
Support high-performance computing with less reliance on water-intensive cooling approaches.
Extend Asset Life
Make better use of existing data centre infrastructure while supporting higher compute demands and evolving workloads.
Engineered for Efficiency. Proven in Testing.
Independent testing under
identical operating conditions.
Ready to Rethink Your Cooling Architecture?
Ready for higher-density computing?
