Total Immersion. Directed Flow.
A different architecture for high-density thermal management.
As AI and high-performance computing drive increasing rack densities, managing heat efficiently is becoming a critical infrastructure challenge.
TIDF® — Total Liquid Immersion with Directed Flow is LiquidCool Solutions' patented liquid-cooling architecture, combining single phase component immersion with precision-directed flow within a self-contained chassis in a standard 19″ rack format.
The principle is simple: the dielectric fluid goes where the heat is.
TIDF® immerses the entire server in dielectric fluid, while directed flow actively routes dielectric fluid towards the components generating the greatest heat.
Engineered Around the Heat
Unlike approaches that focus cooling primarily on individual processors, TIDF®
provides thermal coverage across the complete server components and directs dielectric fluid to the hottest components.
Total Immersion
Every heat-generating component is immersed in dielectric
fluid — not just the processor.
Directed Flow
Dielectric fluid is actively guided towards the areas generating
the greatest thermal load.
Fully Contained Architecture
The cooling system operates within a contained chassis rather
than an open immersion tank.
Standard 19″ Rack
Designed to work within the rack architecture already familiar
to data-centre operators.
Verified by Leading Organisations
One Technology.
A Different Cooling Architecture.
TIDF® brings together:
The result is a liquid-cooling architecture designed for AI, HPC, high-density data centres, enterprise computing and demanding edge environments.
